Jun-Hua: Order Visibility Extends to Q2 2027, Benefiting from OSAT Expansion

(CNA, Reporter Chang Chien-chung, Hsinchu, 19th) Semiconductor equipment manufacturer Jun-Hua held its annual shareholders' meeting today, stating that due to accelerated capacity expansion by packaging and testing companies, Jun-Hua's order intake is strong, with order visibility extending to the second quarter of 2027. Jun-Hua pointed out that in addition to wafer fabs continuing to actively invest in expanding advanced packaging capacity, the expansion momentum of packaging and testing companies this year is strong, with capital expenditure expected to double, and Jun-Hua's operations should benefit. Jun-Hua stated that as its coverage of equipment related to advanced packaging processes has increased to 90%, it has injected growth momentum into its operations. The cumulative revenue for the first four months of this year was NT$1.164 billion, an annual increase of 104.96%, and full-year revenue is expected to set a new historical high. Jun-Hua noted that sales of its die bonder products have grown for three consecutive years, with their proportion of total revenue climbing to 22% in 2025, and it is expected that they may surpass the current mainstay, sorting machines, in the next one to two years. (Edited by Yang Kai-hsiang) 1150519