Hiwin Mikrosystem Expects Strong Performance; Semiconductor Applications Exceed 50%

Central News Agency, Taipei, May 26: Hiwin Mikrosystem, a manufacturer of precision motion and control components, held its shareholder meeting in Taichung today, approving a cash dividend of NT$0.8 per share. Chairperson Cho Hsiu-yu stated that demand for semiconductors, silicon photonics, and high-end PCB measurement and inspection equipment is strong, with semiconductor applications now accounting for over 50% of the company's total revenue. Cho noted that the company is actively investing in semiconductor applications, including validation for FOPLP and CoPoS advanced packaging. Shipments for silicon photonics inspection equipment began in April, and the company expects the revenue contribution from these machines to gradually increase by 2027. Additionally, demand for linear motors and precision controllers remains robust, with orders and sales growing by over 30% in the first five months of this year. Looking ahead, Cho expects performance to exceed 2025 levels, driven by strong demand in advanced packaging, AI, and high-bandwidth chips. Regarding geopolitical risks and rising material costs, the company implemented price hikes in April, which were accepted by customers, keeping the impact within a manageable range. To meet strong demand, capital expenditure will be increased to NT$200 million this year.