Entegris and JSR/Inpria Announce Cross-License Agreement for EUV Lithography

Entegris, Inc., a global leader in advanced materials and high-purity solutions for the semiconductor industry, and JSR Corporation, a leader in material innovation and the parent company of Inpria Corporation, today announced a non-exclusive cross-license agreement aimed at supporting the advancement of extreme ultraviolet (EUV) lithography for next-generation chip manufacturing.

Under this agreement, Entegris and Inpria will cross-license patents related to metal oxide resists (MOR), terminating the pending Inter Partes Review (IPR2025-00267). The parties will also explore potential for future collaboration on photoresist materials. This collaboration may cover resist design, precursor synthesis and development, as well as high-purity filtration technology and related delivery systems essential for stable performance in high-volume MOR manufacturing for EUV applications.

By combining JSR and Inpria's comprehensive leadership in MOR materials with Entegris’ expertise in MOR precursors for CVD deposition, material handling, and high-purity filtration, the collaboration aims to expand the application of advanced materials in semiconductor manufacturing as both companies scale for the AI era.

Olivier Blachier, SVP and Chief Strategy & Innovation Officer at Entegris, noted that the agreement demonstrates ecosystem-wide progress, helping customers adopt next-gen lithography with confidence. Toru Kimura, Senior Executive Officer at JSR, added that merging Inpria’s innovative technology with Entegris’ purification know-how will broaden the scope of these technologies in the semiconductor material ecosystem.