FDK Begins Sample Shipments of New Ultra-Compact Module "HY0025" Supporting Bluetooth® ver.6

FDK CORPORATION (President and CEO: Hiroshi Shimozono, hereinafter FDK) has developed the new product "HY0025" as the third in its series of the world's smallest class Bluetooth® Low Energy (hereinafter Bluetooth LE) modules. Sample shipments to select domestic customers will commence in July. Sample shipments to general domestic customers and overseas customers are scheduled to begin in January 2027.

This product, "HY0025," like the existing products "HY0020" and "HY0021," is an ultra-compact Bluetooth LE module utilizing TOSHIBA CORPORATION's SASPTM technology. With SASP technology, the antenna is formed on the top surface of the module within a shielded package, eliminating the need for a large keep-out area around the antenna and achieving the world's smallest class mounting substrate footprint. This product is ideal for wireless transmission of various sensor data in the fields of physical AI and healthcare data utilization.

The new product "HY0025" is equipped with Nordic Semiconductor's "nRF54L15" SoC, which supports Bluetooth ver.6. In addition to conventional Bluetooth LE communication functions, it supports long-range communication via Coded PHY and the Channel Sounding function, which enables high-precision measurement of distances between devices. This is expected to foster the creation of new applications that utilize position and distance information.

Furthermore, this product incorporates an Arm® Cortex®-M33 processor operating at 128 MHz, along with 1.5 MB of NVM and 256 KB of RAM. This allows for flexible support of applications requiring advanced wireless and sophisticated security functions. It achieves a maximum output power of +8 dBm and a receiving sensitivity of -96 dBm, with an operating temperature range of -40°C to +105°C, making it suitable for use in harsh environments such as industrial applications and automotive-related equipment.

Additionally, "HY0025" shares the same terminal arrangement as the previous product "HY0020," facilitating easy replacement from existing designs. This enables a smooth upgrade to next-generation Bluetooth LE functions while leveraging existing substrate design assets.

Moreover, in addition to Bluetooth LE, it supports multiprotocols such as Thread®, MatterTM, and Zigbee®, allowing for broad deployment in the expanding IoT market and smart infrastructure fields.

Through this product, FDK will provide high-value-added wireless solutions that meet the needs of the increasingly sophisticated and diverse IoT market and location information utilization, contributing to the realization of a society that connects people and things.

Key Features of the New Product "HY0025"

1. Supports Bluetooth ver.6

2. High-precision distance measurement with Channel Sounding support

3. Long-range communication with Coded PHY support

4. Ultra-compact package with integrated antenna using SASP technology

5. Pin-compatible design with HY0020

6. Multiprotocol support (Bluetooth LE, Thread, Matter, Zigbee)

7. Wide operating temperature range (-40°C to +105°C)

Main Applications

Digital keys, smart locks, asset management tags, monitoring terminals, high-precision ranging/positioning devices, healthcare devices, various IoT terminals

Main Specifications

Bluetooth SoC

Nordic Semiconductor nRF54L15

CPU

Arm Cortex-M33 (128 MHz)

Memory

1.5 MB NVM / 256 KB RAM

Maximum Output Power

+8 dBm

Receiving Sensitivity

-96 dBm

General Purpose I/O

15 pins + nRESET

High-Speed Clock

32 MHz Internal

Low-Speed Clock

32.768 kHz Internal

Power Supply Voltage

1.7 to 3.6 V

Operating Temperature Range

-40°C to +105°C

Dimensions

3.5 × 10 × 1.3 mm

Certifications (Planned)

Bluetooth

Type Approval

FCC

ISED

(ETSI EN300 328 V2.2.2)

*The Bluetooth® word mark is a registered trademark owned by Bluetooth SIG, Inc. FDK CORPORATION uses these marks under license.

*SASPTM is a registered trademark of TOSHIBA CORPORATION, and SASP technology is a patented technology of TOSHIBA CORPORATION. FDK CORPORATION has entered into a license agreement with TOSHIBA CORPORATION.

*Arm and Cortex are trademarks of Arm Limited (or its subsidiaries) in the US and/or other countries.

*Thread® is a registered trademark of Thread Group, Inc.

*MatterTM is a trademark of the Connectivity Standards Alliance.

*Zigbee® is a registered trademark of the Connectivity Standards Alliance.