Electronics trading company Marubun Corporation will participate in the 'Total Solution Exhibition for Electronic Equipment 2026,' held at Tokyo Big Sight from June 10 (Wed) to June 12 (Fri). The company will showcase next-generation packaging development equipment, including the 'FC300' for ultra-high-precision assembly required in fields such as micro-LEDs, quantum computers, and silicon photonics, as well as the 'NEO-HB' for mass production.

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  • Source: PR TIMES
  • Category: press_release