MECCANISMO・LAB株式会社 News Releases

MECCANISMO・LAB Develops Fully Automatic 6-Inch Wafer Bonding System at 120°C and Atmospheric Pressure

MECCANISMO・LAB 成功開發基於 NIMS 技術的 6 吋全自動晶圓鍵合裝置，實現 120℃ 大氣壓下之低溫接合。 · 2026-05-12

MECCANISMO・LAB Achieves Wafer Bonding at 120℃ and Atmospheric Pressure, Develops 6-inch Fully Automatic Bonding Machine Based on NIMS's Technology

MECCANISMO・LAB has developed a fully automatic 6-inch wafer bonding machine that operates at 120℃ an… · 2026-05-12