On April 13, 2026, Molex announced an expanded Co-Packaged Optics (CPO) interconnect toolkit and a new high-radix Optical Circuit Switch (OCS) platform for hyperscale data centers. These technologies aim to resolve bottlenecks in AI cluster scaling, offering improved maintainability, an 85% reduction in deployment time, a 50% increase in density, reduced system power consumption, and enhanced GPU cluster scalability and efficiency. Molex is also commercializing Teramount's TeraVERSE detachable fiber connectivity products through a collaboration.
Molex announced a product roadmap to address the large-scale scaling requirements of hyperscale data centers. The Co-Packaged Optics (CPO) interconnect toolkit has been expanded to resolve bottlenecks in AI cluster scaling. A new high-radix Optical Circuit Switch (OCS) platform was introduced to meet new data requirements. The OCS platform provides large-scale, reconfigurable optical connectivity with minimal network overhead, improving GPU cluster scalability and efficiency. AI infrastructure operators can dynamically reconfigure network topologies and maximize computing resource utilization. Peter Lee of Molex stated that the goal is to provide comprehensive and differentiated optical solutions supporting next-generation AI infrastructure, aiming for improved scalability, operational efficiency, and energy efficiency. The VersaBeam EBO backplane connector integrates up to 192 fibers, enabling 'blind' installation by shifting connectivity to pre-configured optical backplanes. EBO technology reduces sensitivity to dust and foreign objects, minimizing cleaning, inspection, and maintenance needs, and reducing deployment time by up to 85%. The combination of Molex VersaBeam EBO backplane connectors and Teramount TeraVERSE detachable fiber connectivity products creates a continuous, high-performance optical path and a modular, 'swappable' architecture. This minimizes damage to fiber interfaces and reduces the need for on-site optical technology experts. Hesham Taha of Teramount commented that the collaboration between Molex and Teramount is a game-changer for the industry, enabling hyperscalers to accelerate the adoption of flexible, high-performance optical solutions. The Molex CPO toolkit includes the Versatile Format Interconnect (VFI) optical backplane system and External Laser Source Small Form Factor Pluggable (ELSFP).
FACT BOX
- Source: PR TIMES
- Category: New Product発表, 技術発表, パートナーシップ
FAQ
What is Molex's primary goal in accelerating AI cluster deployment?
Molex aims to provide comprehensive and differentiated optical solutions that enhance scalability, operational efficiency, and energy efficiency for next-generation AI infrastructure.
How does Molex's new high-radix Optical Circuit Switch (OCS) platform benefit AI infrastructure?
The OCS platform offers large-scale, reconfigurable optical connectivity with minimal network overhead, significantly improving GPU cluster scalability and efficiency by allowing dynamic network topology reconfiguration.
What is the key advantage of Molex's VersaBeam EBO backplane connector in AI cluster deployment?
The VersaBeam EBO backplane connector integrates up to 192 fibers and enables 'blind' installation, reducing deployment time by up to 85% and minimizing the need for cleaning, inspection, and maintenance due to its reduced sensitivity to dust.
What problem does the expanded Co-Packaged Optics (CPO) interconnect toolkit address?
The expanded CPO interconnect toolkit is designed to resolve bottlenecks that hinder the large-scale scaling requirements of AI clusters in hyperscale data centers.
How does the collaboration between Molex and Teramount benefit hyperscalers?
The collaboration enables hyperscalers to accelerate the adoption of flexible, high-performance optical solutions by creating a continuous, high-performance optical path and a modular, 'swappable' architecture.