Ligitek (8111-TW), an LED packaging manufacturer, has successfully penetrated the U.S. AI supply chain with its silicon photonics initiatives. Combined with the delayed project acceptance in the second half of the year now being gradually recognized, the company has attracted significant capital inflows. On Wednesday (23), strong buying pressure drove the stock price up to the daily limit of NT$56.8, before easing slightly while still maintaining a gain of over 8%. Trading volume surged to five times the previous day's level.

The company's 1.6T co-packaged optical module has reportedly been adopted into a U.S. AI supply chain, with European clients entering the certification phase. Initial small-volume shipments are expected in the fourth quarter, ramping up to mass production starting in Q1 of next year. Ligitek's newly constructed cleanroom laboratory is scheduled to become operational in August, supporting subsequent product verification and mass production readiness.

Ligitek previously joined the silicon photonics alliance led by TSMC (2330-TW) and ASE (3711-TW), and has collaborated with the Industrial Technology Research Institute (ITRI) to develop high-end 1.6T and 3.2T modules. Through a full-module delivery strategy, the company can reduce the number of transmission lines and system integration costs, while gaining greater control over design and pricing.

In 2023, Ligitek restructured its system-in-package (SiP) product lines into two main pillars: low-end and high-end. The low-end segment covers AI networking, 3C electronics, and biomedical applications, while the high-end focuses on silicon photonics for data centers and biomedical sensing. Including its long-developed robotic image recognition modules, AI and silicon photonics now account for 45% of annual revenue, becoming the primary driver of growth.

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  • Source: PR Times
  • Category: New Product