Gowintron's H1 Performance Surpasses Full-Year 2025, Secures 800G/1.6T Optical Coupling Orders

Driven by the rapid deployment of AI data centers and the upgrade to high-speed optical communications, demand for high-precision automated coupling equipment continues to grow. Gowintron (4573-TW), which transitioned from lens assembly to optical communication coupling stations, achieved NT$703 million in revenue from January to June 2026—surpassing its full-year 2025 revenue. Analysts project that second-half revenue and profitability will significantly outperform the first half, implying that 2026 full-year performance will more than double that of the previous year.

Gowintron has passed certification from one of the world’s top 10 optical communication brand manufacturers and secured orders for 800G and 1.6T optical coupling alignment products. The company has also entered the high-growth markets of CPO packaging testing and FAU+MLA precision assembly.

As a member of the Silicon Photonics Alliance, Gowintron has strengthened its operations since 2026, with growing momentum in order intake and shipments within the AI high-speed transmission and optical communication equipment sectors. Additionally, the company successfully raised NT$1.3 billion through a private placement of 4,000 new shares at a premium price of NT$325 per share. Chairman Chen Chi-Hsin stated that the successful capital raise reflects capital market recognition of Gowintron’s strategic pivot to silicon photonics equipment. Leveraging decades of expertise in precision motion control and integrating AI alignment algorithms, Gowintron aims to become an indispensable optical coupling solution provider in the CPO supply chain.

In its business expansion, Gowintron has already obtained certification from one of the world’s top 10 optical communication brands and secured orders for 800G and 1.6T optical module coupling alignment modules. It has also entered the CPO packaging test equipment and FAU+MLA precision assembly markets. As customer projects progress, the company’s backlog and operational visibility are steadily increasing. Analysts expect second-half revenue and profits to significantly exceed first-half results.

The rise of AI computing is driving demand for high-speed optical interconnects. The global optical communication industry is rapidly shifting from traditional pluggable optical modules to NPO (Near-Packaged Optics) and CPO (Co-Packaged Optics) architectures. By shortening electrical signal transmission distances and reducing power consumption, these new architectures meet the high-speed transmission needs of next-generation AI servers and large data centers—simultaneously accelerating demand for high-precision optical coupling, optical measurement, automated assembly, and packaging test equipment.

Gowintron serves as a critical equipment supplier linking optical components, photonic integrated circuits (PICs), and packaging processes. At its core are the six-axis active alignment platform, AI coupling algorithms, wafer-level optical inspection, and automated integration technologies. The company offers comprehensive solutions including wafer-level testing, optical module coupling, FAU+MLA precision assembly, NPO, and CPO packaging testing—helping customers shorten development cycles, improve mass production yields, and accelerate time-to-market for high-speed optical communication products. Gowintron positions itself as a leading optical coupling solution provider.

Recently, a major central-based optics manufacturer has expanded into FAU and MLA optical communication components, while an international fiber optics giant has launched GlassBridge glass optical interconnect technology. These moves indicate that the global optical and optical communication supply chain is accelerating its positioning in the next-generation AI high-speed optical interconnect market. As optical component integration density increases and optical interconnect architectures evolve, the importance of coupling precision, optical loss control, packaging yield, and mass production efficiency is rising in tandem.

Gowintron emphasizes that regardless of whether FAU, MLA, or GlassBridge optical interconnect technologies are adopted, mass production still relies on key process technologies such as high-precision positioning, active optical coupling, and optical measurement. As global leaders actively invest in next-generation optical interconnect components and technologies, not only is the industry ecosystem maturing faster, but demand for precision assembly, optical inspection, and automation equipment is also increasing—creating new growth opportunities for Gowintron in the AI high-speed optical communication mass production equipment market.

Currently, optical coupling technology is primarily divided into two architectures: surface grating coupling (Grating Coupling, GC, vertical coupling) and edge coupling (Edge Coupling, EC, side coupling). GC offers advantages in wafer-level testing, process standardization, and mass production efficiency, while EC is widely used in new optical interconnect solutions such as GlassBridge. Both architectures will coexist and evolve based on different product designs and application requirements, jointly advancing the evolution of AI high-speed optical interconnect technology.

Gowintron notes that for high-precision active optical coupling, regardless of whether GC or EC architecture is used, mass production depends on key process capabilities such as high-precision positioning, optical measurement, and automated integration. With its core technologies—six-axis active alignment platform, AI coupling algorithms, and wafer-level optical inspection—Gowintron supports critical processes including wafer-level testing, optical module coupling, packaging assembly, and mass production ramp-up, consistently capturing equipment demand driven by upgrades in AI high-speed optical interconnect technology.

Gowintron's silicon wafer equipment. (Photo: Gowintron)

Driven by market momentum, as CPO accelerates toward mass production, the testing process is gradually forming a four-stage framework from Insertion 1 to Insertion 4. Gowintron has been identified as a key equipment vendor. With its six-axis active alignment platform and AI coupling algorithms at the core, the company overcomes the time-consuming active alignment bottleneck in Insertion 1 and focuses on Insertion 3—optical engine (Optical Engine, OE) coupling assembly and testing—supporting advanced packaging processes such as RCP/COUPE. This allows Gowintron to capture the critical business opportunity as equipment demand expands from wafer fabs to specialized packaging and test houses (OSATs). Simultaneously, by entering FAU+MLA precision assembly, the company extends its nanoscale alignment technology into the optical component supply chain, further expanding its market application scope.

Additionally, Gowintron will participate in the International Semiconductor Exhibition starting September 2, showcasing its latest solutions in silicon photonics, CPO, high-precision active coupling, FAU+MLA precision assembly, and wafer-level optical inspection. This will deepen collaboration with global semiconductor and optical communication customers and expand business opportunities in the AI high-speed optical interconnect market.