Paving the Way for Mass Production Validation! Korean Media: SKC’s Absolics Launches Glass Substrate Packaging Sample Evaluation in Taiwan, Aiming for PoC This Year

South Korean chemical materials company SKC announced on Monday (27th) its second-quarter financial results, revealing that embedded glass substrate samples from its U.S. Georgia subsidiary, Absolics, have arrived in Taiwan to initiate preliminary 'package-level reliability evaluation.' This is regarded by the industry as the final technical validation stage before mass production.

According to Korean media outlet THE ELEC, unlike previous evaluations that tested only individual substrates, package-level evaluation requires embedding the glass substrate into an actual semiconductor package to verify electrical characteristics, thermal durability, and mechanical reliability. Absolics first completed substrate-level internal reliability (hammering) tests at its Georgia facility, then conducted preliminary electrical characteristic assessments in Japan. Only after producing 'qualified chip' samples that meet design specifications and yield targets did the company proceed to the package-level evaluation phase in Taiwan. Results are expected by year-end, after which discussions with customers will begin on moving into proof-of-concept (PoC) phases.

Absolics is pursuing a dual-track strategy of 'embedded' and 'non-embedded' approaches. The embedded type involves embedding passive components like MLCCs and fine TGV wiring inside the glass substrate, taking over the role of silicon interposers. This is the most technically challenging and aims for global first-to-market mass production. The non-embedded type replaces the organic core of FC-BGA packages with glass, leveraging its low warpage and high flatness to suppress deformation and stabilize fine lines. With lower technical barriers, this approach has a faster commercialization path. The non-embedded version was launched earlier this year and is already under joint development with multiple global customers. Some projects are expected to finalize supplier selection in the second half of the year, with PoC initiation targeted before year-end.

Earlier this year, SKC raised 1.1647 trillion KRW through a share offering, allocating approximately 589.6 billion KRW directly to Absolics. For this year, 37.6 billion KRW will be allocated to customer certification and production operations, while future equipment upgrades and large-scale expansion will be determined based on evaluation feedback and market demand. The company is currently finalizing execution details with strategic partner Applied Materials.

During the transition period where AI accelerator packaging is shifting from organic ABF substrates to glass cores, news that Absolics has sent samples to giants like AMD and AWS for testing has already stirred the supply chain.

If SKC’s package-level evaluation in Taiwan proceeds smoothly, it would bring glass substrates one step closer to mass production by 2027. However, if thermal cycling or warpage data fail to meet automotive or data center standards, PoC and volume ramp-up timelines could be delayed again. For SKC, this represents a critical battle in its materials transformation strategy.