PCB Upstream Copper Foil Manufacturer Rongke Completes NT$2.1 Billion Rights Offering; New Shares to Begin Trading August 3

PCB upstream copper foil manufacturer Rongke (4989-TW) has completed a rights offering at a premium price of NT$60 per share, issuing 35,000 new shares and raising a total of NT$2.1 billion from the market. The company announced today (29) the successful completion of the fundraising. Rongke's newly issued shares will begin trading on August 3.

However, amid a downturn in the Taiwan stock market, Rongke closed today at NT$55.5, below the rights issue price.

Rongke's revenue for the first quarter of 2026 reached NT$977 million, with a gross margin of 4.93% and a net profit of NT$18.29 million, turning profitable compared to a loss in the same period last year. Earnings per share (EPS) for the quarter were NT$0.13. In June 2026, Rongke reported revenue of NT$370 million and a self-calculated net profit of NT$18.3 million—matching its first-quarter profit—with a monthly EPS of NT$0.13.

Rongke is actively advancing the production of high-end high-frequency, high-speed copper foil. HVLP3 and HVLP4 are currently in the sample testing and delivery phase, while HVLP5 is under development. The end applications for HVLP3 and HVLP4 are AI PCs and servers.

With rapidly growing demand for AI server applications, the supply-demand gap for high-end copper foil HVLP4 (fourth-generation ultra-low roughness) is expected to widen further in 2026. Currently, copper foil manufacturer Jinju (8358-TW) is also expanding and adjusting its production lines, converting them to produce HVLP3 or HVLP4.