PeelTech Records Highest Monthly Revenue in July, Second-Half Performance to Outperform First Half

PeelTech (7822-TW), a manufacturer of inspection and metrology equipment, announced its July revenue today (5th). Benefiting from the explosive global demand for AI chips and major semiconductor packaging companies actively expanding their CoWoS production capacity, PeelTech achieved July revenue of NT$273 million, representing a 7.78% month-on-month increase and a 63.4% year-on-year growth, setting a new all-time high for single-month revenue. Cumulative revenue for the first seven months reached NT$1.692 billion, up 86.26% year-on-year.

PeelTech stated that strong procurement momentum for AI servers and high-performance computing (HPC) chips worldwide has driven leading semiconductor foundries and OSATs to accelerate expansion of advanced packaging capacities such as CoWoS, 3D packaging, and panel-level packaging (PLP). Due to the extreme complexity and stringent yield requirements of advanced packaging processes, demand for high-precision AI intelligent optical inspection and semiconductor metrology equipment continues to rise.

Leveraging its self-developed high-end AI optical inspection algorithms and precision measurement technologies, PeelTech has successfully entered the supply chains of top-tier global semiconductor leaders. Supported by dual orders from wafer fabs and packaging/test facilities, the company’s delivery schedule remains fully loaded, serving as the primary driver behind its consistently robust revenue growth since the beginning of the year. Year-on-year growth rates have repeatedly exceeded 50% to 80%, demonstrating exceptional market competitiveness and growth potential.

Looking ahead, as the semiconductor industry enters the traditional equipment delivery and acceptance season, major customers continue to advance their capacity expansion plans. PeelTech’s backlog of orders is currently at a historical high level.

PeelTech emphasized that while maintaining technological leadership in traditional wafer and advanced packaging AOI fields, it is also continuously investing in next-generation process metrology equipment and AI-powered inspection platforms. The benefits are expected to gradually materialize as customer production capacities come online. Analysts project that with ongoing advanced packaging industry tailwinds and sequential equipment acceptance bookings, PeelTech’s second-half performance will surpass the first half, with both full-year revenue and profitability having the potential to reach new historical highs.