Winson Reports July Revenue of NT$1.6 Billion, Up 155% Year-on-Year, Setting New Record High

Winson (6515-TW) announced today (6th) that its revenue for July reached NT$1.6 billion, representing a 9.6% increase from the previous month and a 155.57% year-over-year surge. Cumulative revenue for the first seven months of the year totaled NT$8.104 billion, up 82.29% compared to the same period last year. Winson stated that the surge in AI application demand has led to continuous volume growth in high-end products, driving the company's July revenue to a record monthly high.

The company noted that in response to rising global AI customer demand for advanced testing, it has continuously adjusted and expanded new production capacity, enabling rapid customer response while achieving record-breaking performance for two consecutive months.

Although concerns about an AI bubble and overinvestment persist in the market, major CSP operators have recently raised their capital expenditures, further confirming that the AI infrastructure investment cycle remains in its early stages. The explosive AI demand is driving continued growth in capital spending for CSP data center construction and expanding next-generation infrastructure such as GPUs and liquid cooling systems to meet the computing power demands brought by the rapid development of generative AI and large-scale models. This momentum will drive growth across the semiconductor ecosystem.

According to DataM Intelligence, driven by AI, 5G, HPC, and automotive applications, the global semiconductor packaging and testing market is projected to grow from $36.58 billion in 2025 at a compound annual growth rate of 6.9%, reaching $63.13 billion by 2033. Amid this growth trend, Winson continues to capture opportunities in high-end packaging and testing, meeting AI application demands for ultra-large packages, ultra-high power consumption, and high pin counts.