Infineon Partners with MediaTek to Capture Market Opportunity Amid Automotive NOR Flash Shortage

Infineon today (7th) announced a partnership with MediaTek (2454-TW) to deliver advanced, AI-driven automotive cockpit experiences for future vehicles. Its automotive-grade NOR Flash memory has completed certification on MediaTek’s Dimensity Auto Cockpit Platform C-X1, offering automakers, Tier-1 suppliers, and design partners developing next-generation smart cockpit systems a certified and easy-to-adopt memory solution.

Rainer Hoehler, Senior Vice President of Memory Solutions at Infineon, stated, "Automotive memory is a key enabler of innovation, as software-defined vehicles rely on high-performance system-on-chips (SoCs), increasingly complex firmware, and massive data storage. Advanced digital cockpits and OTA (over-the-air software updates) capabilities are driving demand for higher-capacity NOR Flash. With certification by MediaTek, customers can now more easily adopt Infineon’s 512 Mb NOR Flash to build future-ready smart cockpit memory solutions."

Zhang Yutai, Deputy General Manager and Head of Automotive Business at MediaTek, said, "Infineon’s automotive-grade NOR Flash delivers enhanced performance, reliability, and functional safety for our high-end flagship Dimensity Auto Cockpit Platform C-X1. Its high-capacity design supports essential advanced AI and user experience features in next-generation software-defined vehicles (SDVs). Building on our long-term collaboration, we leverage Infineon’s industry-leading strengths to provide a reliable foundation for the evolving software-defined ecosystem."

Infineon’s 512 Mb QSPI NOR Flash memory stores firmware and boot code to support AI-driven functions at the SoC level, such as voice assistants, driver monitoring, vlogging during travel, environmental awareness, and personalized audio-video recommendations. The solution supports safe and secure boot and provides critical redundancy functions to enhance safety. This product uses Infineon’s MirrorBit technology, features a robust interface, wide compatibility with mainstream automotive SoCs, AEC-Q100 qualification, and supports operating temperatures up to +125°C.