Topway Announces New AI Infrastructure Solution Integrating Memory and Four Key Technologies

Topway (8112-TW) announced today (10th) that it is leveraging its strengths in memory and storage products to integrate key AI infrastructure technologies—thermal management, power supply, and monitoring—officially entering the AI data center infrastructure market.

Topway noted that the rapid development of agent-based AI, high-performance computing (HPC), and large language models (LLMs) is accelerating enterprise adoption of AI data centers. Behind this trend, beyond raw computing power, stable thermal dissipation, power delivery, and monitoring capabilities are essential. In addition to a full product portfolio, Topway offers end-to-end services including pre-sales selection, deployment assessment, testing and validation, and post-sales technical support to help enterprises build and operate data centers more efficiently.

Ge Jun, Chairman and CEO of Topway, stated, "Competition in the AI era is no longer limited to computing power, but extends to thermal management, power supply, and overall infrastructure efficiency. The real key lies in whether the infrastructure can support a company’s growth over the next 5 to 10 years." Topway will leverage its years of global partnerships with original equipment manufacturers (OEMs) and technical service capabilities to help enterprises develop tailored strategies—from planning and integration to long-term operations—for building AI data centers.

Topway observes that the approach to building AI data centers is rapidly evolving. As AI servers’ power consumption and computational density rise, enterprise challenges now extend beyond GPU and server performance to include thermal management, power delivery, and system stability.

The company notes that enterprises now expect partners to offer more than just products—they seek strategic allies with technical support, resource integration, and deployment planning capabilities. This shift is the core driver behind Topway’s expansion into infrastructure, aiming to consolidate OEM resources and technical expertise to become the most trusted partner for next-generation AI data center deployment.

Building on its deep roots in the memory and semiconductor markets, Topway is expanding its AI infrastructure footprint by developing comprehensive solutions covering memory, thermal management, power, and monitoring. In memory and storage, it continues to support high-speed memory architectures for LLMs and high-density computing using Samsung products. In thermal and thermal management, it integrates Castrol coolants, Motivair by Schneider Electric’s liquid cooling solutions, and Emerson’s fluid control solutions to meet liquid cooling and high-efficiency thermal demands.

In power and monitoring, Topway combines Schneider Electric’s uninterruptible power supplies (UPS), rack power distribution units (PDUs), and monitoring management solutions to enhance power stability and operational efficiency. With its comprehensive product portfolio and OEM partnerships, Topway can assist enterprises in product selection, deployment planning, and AI infrastructure setup based on specific application needs.

Looking ahead, Topway will continue expanding its AI infrastructure product offerings and global OEM collaborations to meet the evolving demands of AI, HPC, and data centers. Beyond the four core technology areas—memory, thermal, power, and monitoring—the company will strengthen its local technical support teams, deepen OEM collaboration mechanisms, and enhance customer service to help enterprises overcome challenges in AI data center deployment, upgrades, and long-term operations.

Topway will also serve as a critical bridge connecting OEM resources, product technologies, and local service capabilities, jointly improving enterprise AI infrastructure deployment efficiency and overall operational resilience.