Semiconductor equipment manufacturer Walsin (6187-TW) participated in the TPEx earnings presentation today (27th). Spokesperson Lucy Lu stated that driven by the AI wave boosting strong demand for advanced packaging, the company's capacity utilization remains consistently high and fully loaded. The company is also actively expanding its service and R&D sites in overseas markets. Based on currently secured customer orders and project plans, overall order visibility has clearly extended into Q2 2027.
Lucy Lu stated that Walsin has long been committed to five core areas: automation, precision dispensing, bonding, optical inspection, and silicon photonics. The company emphasized its commitment to fully in-house design and development of key dispensing valves, enabling high customization to accommodate different adhesive viscosities and dispensing paths for customers. Additionally, amid the trend of 3D chip stacking, bonding equipment has been widely adopted in heat spreader and system-on-chip (SoC) packaging. By integrating standalone machines into one-stop integrated production lines, Walsin has significantly improved customers' yield management efficiency.
Regarding next-generation technology advancement, Lucy Lu noted that Walsin is actively investing in R&D for silicon photonics optical coupling equipment, providing customers with comprehensive solutions covering various coupling processes and yield improvements. All currently engaged products are new projects, and long-term growth momentum is highly anticipated.
On delivery and recognition timelines, Lucy Lu explained that typical repetitive mass-production machines are accepted and recognized within approximately 1–2 months after shipment, while next-generation or customized equipment requires a 6–12 month validation period, with equipment manufacturing lead times ranging from 3–8 months.
Lucy Lu mentioned that Walsin adopts a light-asset operational model, focusing on R&D and design while leveraging outsourced manufacturing and flexible manpower for assembly. The company has established operational, R&D, and service sites in the United States, Japan, Malaysia, and across Taiwan in Hsinchu, Taichung, and Kaohsiung Nanzih.
Through localized engineering support and cross-site process consistency maintenance, Walsin continues to deepen collaboration with major foundry manufacturers and OSAT partners, firmly positioning itself to capture business opportunities in advanced packaging and silicon photonics.
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- Source: PR Times
- Category: News