Chitronix, TSMC Supply Chain Member, Celebrates 60th Anniversary with AI Core Business Accounting for 70% of H1 Revenue

Founded in 1966, Chitronix (2467-TW), a member of the G2C+ alliance, is currently part of TSMC's (2330-TW) supply chain and celebrates its 60th anniversary this year. Chitronix stated that in the first half of 2026, semiconductor-related revenue accounted for 46% of total revenue, and when combined with advanced PCB, AI core business reached 70%.

Additionally, in Chitronix's backlog, advanced packaging accounts for 54% and advanced PCB for 38%, totaling 92%. This indicates that the company's operational focus continues to shift toward high-end AI manufacturing.

Since its founding in 1966, Chitronix has evolved alongside Taiwan's manufacturing and technology industries, expanding its application areas from traditional industries and PCBs to displays, semiconductors, advanced packaging, and the AI supply chain. Through multiple industry cycles, the company has accumulated core process capabilities in 'pressing, bonding, peeling, and baking,' extending these to wafer-level and panel-level advanced packaging, IC substrates, high-layer-count boards, and high-end PCBs.

Chitronix noted that as AI chips advance toward multi-die, high-stacking, large-size, and high-precision designs, manufacturing processes demand higher standards in warpage control, uniformity, precise alignment, temperature control, and material integration. Leveraging cross-industry process experience, Chitronix is focusing on three AI hardware upgrade paths—computing, high-speed interconnect, and power efficiency—with equipment applications spanning advanced packaging, IC substrates, high-end PCBs, optical engines, and power semiconductors.

To support global customer expansion, Chitronix plans to further strengthen its local service presence in the U.S. in 2026 and establish a Southeast Asian platform in Malaysia and Singapore, bringing equipment and services closer to customers. The company is also introducing digital twin technology to transform 60 years of process expertise into cumulative, reusable digital assets, advancing equipment development from visualization and data-driven approaches to physical simulation and AI applications. Chitronix stated its next phase will focus on 'supporting AI manufacturing while also applying AI,' deepening its footprint in advanced packaging and advanced PCB.

The G2C+ strategic alliance, comprising Chitronix, Juno Precision (5443-TW), JHK Precision (6640-TW), and TSE Technology (8064-TW), is advancing AI smart manufacturing and global market expansion. TSE officially joined G2C+ in April 2026, further integrating operational sites along Taiwan's western technology corridor, bringing the alliance closer to major semiconductor clusters and customer needs. This marks G2C+'s evolution from a collaboration among three founding companies to a more comprehensive equipment ecosystem.

Chitronix's revenue in July 2026 reached NT$1.168 billion, up 34.33% month-on-month and 1.32 times year-on-year. Cumulative revenue from January to July 2026 totaled NT$6.212 billion, already surpassing the full-year 2025 revenue of NT$6.102 billion, representing an 87.05% year-on-year increase.

In Q2 2026, Chitronix reported revenue of NT$2.783 billion and self-calculated net profit of NT$640 million, up 37.33% quarter-on-quarter, with earnings per share (EPS) of NT$4.09. For the first half of 2026, self-calculated revenue reached NT$5.044 billion, up 78.92% year-on-year. Net profit attributable to owners of the parent company was NT$1.106 billion, up 2.09 times year-on-year, with EPS of NT$7.16.