PiLink Announces Industrial Edge AI Platforms 'PLECO E5/E4'

PiLink Co., Ltd. (Headquarters: Yokohama City, CEO: Kenji Nōkata) will begin sales of two models of the "PLECO" series, an edge AI platform optimized for industrial use, on June 1, 2026. The series includes the high-performance "PLECO E5" based on the Raspberry Pi 5 (Compute Module 5) and the low-cost "PLECO E4" based on the Raspberry Pi 4 (Compute Module 4).

PLECO is an industrial edge AI platform that integrates AI, industrial control, and communication functions. It supports no-code/low-code development and can be deployed using the same architecture from prototyping and PoC (Proof of Concept) to mass production.

PiLink Co., Ltd. will exhibit and unveil this product at the IDEC Yokohama booth inside the Japan Pavilion at the InnoVEX area of COMPUTEX 2026, held in Taipei, Taiwan, from June 2 to 5.

Background of PLECO Development The utilization of AI in manufacturing is rapidly shifting from the cloud to the edge, with increasing demand for real-time processing, stability, and security in factories and infrastructure facilities. On the other hand, challenges such as high initial introduction costs, the need for dedicated hardware, and limitations in scalability have hindered the widespread adoption of AI in system development. "PLECO" is a Raspberry Pi-based product developed as a platform to solve these challenges and innovate edge AI implementation for manufacturing sites domestically and internationally.

Product Overview PLECO is an industrial edge AI platform that integrates AI, industrial control, and communications around a core of the Raspberry Pi Compute Module. Two models are available, selectable based on application and performance needs.

Product Lineup "PLECO E5" Standard model (High-performance type) Based on Raspberry Pi 5 (Compute Module 5) For full-scale operations leveraging high-speed processing and scalability

"PLECO E4" Lite model (Low-cost type) Based on Raspberry Pi 4 (Compute Module 4) For cost-conscious deployments and small-scale systems

Main Specifications (Excerpt): PLECO E5 Processor: BCM2712 Arm Cortex-A76 Quad-core Memory: RAM 8GB, eMMC 64GB [Customizable by model designation] External I/F: - LAN x3 (2x Gigabit, 1x 100M) - USB Type-A x4 (USB 2.0 x2, USB 3.0 x2) - microHDMI x1: Display connection - USB-C x1: eMMC writing only - microSD x1: Data storage (Non-boot) - nanoSIM slot x2 Internal I/F: - M.2 M-key slot x1, M.2 B-key slot x1 - miniPCIe slot x1 - CSI x1, DSI x1, GPIO 40p x1 - FAN control x1, External battery input x1 Power: Rated DC 12/24V, Range DC 9V to 40V Temperature Range: Operating temperature: -20 to +65°C, Storage temperature: -25 to +85°C Dimensions: W 132.4 x D 91.3 x H 44.4 mm (Excluding protrusions) Weight: Approx. 600g

High-Reliability Design for Industrial Use - Operating temperature range: -20 to 65°C - Wide power input range: Supports DC 9-40V - Fanless design - Hardware watchdog included - Security chip included - Long-term supply - 24/7 operation support

Example Applications - Factory equipment anomaly detection and maintenance - Remote monitoring of infrastructure facilities - Robot and transport equipment control - Image processing via edge AI - Data collection and analysis

Key Features ■ Raspberry Pi 5 Compatible Layout Board The greatest feature of PLECO is that half of the main board is designed with almost the same connector placement and GPIO 40-pin layout as the Raspberry Pi 5. This allows many of the wide variety of Raspberry Pi HATs on the market to be used as-is with PLECO.

Flexible Modular Structure PLECO also implements expansion interfaces such as M.2 and miniPCIe on the board. Optional modules like LTE communication modules, NVMe SSDs, AI accelerators, and UPS modules can be added depending on the application.

<Optional Modules> LTE Communication Module - EM7431 - EC25J NVMe SSD - 128GB/256GB/512GB/