AI and HPC Drive High-End Chip Testing Demand! Hanss Reports 122.5% YoY Revenue Growth in June, with Custom Products, Probe Cleaning Materials, and Engineering Services All Growing

AI, high-performance computing (HPC), and advanced packaging are driving increased demand for high-end chip testing, benefiting the entire semiconductor test supply chain. Semiconductor wafer test solutions provider Hanmin Test Systems (7856, hereinafter Hanss) announced today (9) its consolidated revenue for June 2026 reached NT$434 million, up 1.97% month-on-month and 122.53% year-on-year. Cumulative consolidated revenue for the first half of 2026 totaled NT$2.185 billion, a significant 114.5% increase compared to the same period last year. The company stated that June's revenue growth was driven by sustained demand for high-end chip testing, leading to simultaneous growth across its three core businesses: custom products, probe cleaning materials, and engineering services.

Hanss noted that as AI, HPC, and advanced packaging applications rapidly evolve, wafer foundries and OSATs continue to expand high-end test capacity. In addition to rising demand for test equipment, there is also growing demand for custom products, test consumables, and engineering services such as equipment installation, relocation, and maintenance. This has become a key driver behind June's revenue performance.

Notably, AI chips are fueling the global expansion of the semiconductor test market. Compared to traditional processors, high-end chips such as AI GPUs, AI ASICs, and high-bandwidth memory (HBM) consume more power and transmit data at higher speeds. Coupled with increasingly complex advanced packaging technologies, these chips demand higher precision, stability, and probe contact quality from test equipment. As a result, not only are test equipment vendors benefiting, but suppliers providing test consumables, equipment integration, and engineering services are also becoming key beneficiaries of the AI investment wave.

According to SEMI estimates, the global semiconductor test equipment market, after surging to $11.2 billion in 2025, is expected to grow by 12% in 2026 and 7.1% in 2027. This reflects continued expansion of test capacity driven by demand for AI, HPC, and advanced packaging, keeping the entire test supply chain on a growth trajectory.

Regarding technology strategy, Hanss stated that high-power chip testing is placing increasingly stringent demands on test environment stability, equipment reliability, and probe contact quality. The company supports customers in maintaining stable test environments through custom products, while its proprietary probe cleaning materials reduce probe contact anomalies and maintain test quality, thereby improving overall test efficiency.

Beyond product development, Hanss continues to align with its customers' global production expansion, having established service hubs in Taiwan, China, Japan, Malaysia, Singapore, and the United States to provide local technical support, including equipment installation, relocation, modification, and maintenance. As global wafer foundries and OSATs continue to expand high-end test capacity, Hanss aims to help customers improve production line efficiency and capture market opportunities in the AI-driven semiconductor test sector through its comprehensive product and engineering service offerings.