New Comprehensive Analysis Service Launched to Help Reduce Defects in Semiconductor Encapsulants

Toray Research Center, Inc. (TRC), in collaboration with Sanyu Rec Co., Ltd., has developed and launched a new analysis service that comprehensively examines the curing process of thermosetting resins, such as epoxy, from the molecular level to overall material properties. This service can capture the progress of the curing reaction, changes in material properties, and the state of the interface between the resin and the fillers added to the encapsulant. This enables a holistic analysis of the curing phenomenon, which was often understood in separate parts, contributing to clarifying the causes of warping and cracking in semiconductor encapsulants, advancing material design, and optimizing manufacturing processes.