株式會社東麗研究中心（TRC）與Sanyu Rec株式會社共同開發並推出了一項全新的分析服務，該服務能從分子層級到整體材料特性，全面解析環氧樹脂等代表性熱固性樹脂的固化過程。此服務能夠掌握樹脂固化時的反應進程、材料特性的變化，以及封裝材料中添加的填充劑與樹脂之間的界面狀態。這使得過去常被分開理解的固化現象得以進行綜合分析，有助於闡明半導體封裝材料中常見的翹曲、開裂等問題的成因，並促進熱固性樹脂材料的設計升級與製造流程的最佳化。
FACT BOX · 重點整理
- 來源：PR TIMES
- 分類：New Service Announcement
常見問題
What is the new service announced by Toray Research Center?
It is a comprehensive analysis and assessment service, developed with Sanyu Rec, that examines the entire curing process of thermosetting resins like epoxy, from the molecular level to overall material properties.
What specific problems does this service aim to solve?
The service aims to identify the causes of defects in semiconductor encapsulants, such as warping and cracking, which are influenced by the resin's curing behavior, thereby helping to reduce these issues.
How does this new analysis method work?
It combines advanced analytical techniques like Fast Scanning Calorimetry (FSC) and mass spectrometry with Molecular Dynamics (MD) simulations to holistically understand the curing reaction, molecular structure changes, and the resin-filler interface.
What is the main advantage of this service over traditional methods?
Its main advantage is the ability to analyze the curing phenomenon as an interconnected system (reaction, structure, interface), rather than as separate parts, moving beyond reliance on empirical knowledge for material design and process optimization.
What are the expected applications and benefits of this service?
It is expected to be used for improving the reliability of semiconductor packaging materials, advanced material design considering filler-resin combinations, optimizing molding conditions, and enabling more efficient material development.